General information
ACM Solid and Physical Modeling Symposium 2007 (ACM SPM 2007) will be held on June 4-6, 2007, at Tsinghua University, Beijing, China. This is the first time ACM SPM will be held in Asia.
English is the official language of the conference.
Call for paper
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Pierre Bézier Prize
The first annual Pierre Bézier Prize will be Awarded at ACM SPM 2007 for contributions to solid, shape and physical modeling.
UGS Best Paper Award
The Best Paper Award is sponsored by UGS Corporation with 3000$.
Invited speakers

  • Herbert Edelsbrunner, Duke University, USA
  • Gershon Elber, Technion, Israel
  • Shing-Tung Yau (Fields Medal 1982), Harvard University, USA

    • In Cooperation with

  • ACM SIGGRAPH
  • NSFC
  • Chinese Computer Federation
  • CSIAM Geometric Design and Computing

    • Sponsor

  • ACM SIGGRAPH
  • NSFC
  • Sino Frensch Laboratory in Computer Sciences and Applied Mathematics
  • UGS Corporation

    • Past Conferences
    ACM SPM 2006 (Cardiff University)
    ACM SPM 2005 (MIT)
    SPM 2008 in Stony Brook
    ACM Solid and Physical Modeling Symposium 2008 (ACM SPM 2008) will be held on June 2-4, 2008, in Stony Brook University, New York, USA.
    Important Dates
       Abstracts due: November 1, 2006
        Full papers due: November 20, 2006
       Acceptance decisions: January 31, 2007
       Final versions due: March 1, 2007
       Symposium: June 4-6, 2007
    Republication in Journals
    Some papers of outstanding quality will be selected for publication in an extended and revised form in journals of Computer Aided Geometric Design, Computer-Aided Design and IEEE Transactions on Automation Science and Engineering .

       

    If you have any questions or suggestions, please send mail to
    spm2007@tsinghua.edu.cn